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WAKEFIELD Parts List

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103 - Telfon and Nylon Mounting Spool-Shaped Insulator and Washer - 100 Series for use with Series:300, 400, 600, 111, 113. Mounting Hardware:#6-32 Screw; Material:Teflon
120-1280 - THERMAL COMPOUND 5 GALLON PAIL
120-2 - Thermal Joint Compound - Silicone Oil Based Coating. Container Size:2 oz Jar
120-320 - SILICON GREASE 20 LBS CAN
120-5 - Thermal joint compound, silicone oil based coating, container size: 5 oz tube.
120-8 - Thermal Joint Compound - Silicone Oil Based Coating. Container Size:8 oz Jar
120-80 - Thermal Joint Compound - Silicone Oil Based Coating. Container Size:5 lb Can
120-SA - Thermal Joint Compound - Silicone Oil Based Coating. Container Size:4 Gram Plastic Pak
126-2 - Heatsink Accessories NON-SILICONE 2oz THERMAL COMPOUND
126-20012 - Heatsink Accessories HEAT SINK PRODUCT
126-4 - THERMAL COMPOUND 4OZ TUBE NONSILCONE SYNTHETIC 5 YR SHELF LIFE NONTOXIC,ESTER-BASED WITH METAL OXIDE FILLERS (1264)
126-4S - Thermal Joint Compound
126-5LB - 126 Series non-Silicone Thermal Joint Compound, 5 pound can
130-1 - Fasteners, Clamp; Clamp Type:Spring; Clamping Force Max:2000lbf; Material:Stainless Steel
130-5 - Fasteners, Clamp; Clamp Type:Spring; Clamping Force Max:2000lbf; Material:Stainless Steel
130-C - Fasteners, Clamp; Clamp Type:Crossbar; Clamping Force Max:427lbf; Material:Stainless Steel
130-D - 130, 139 SERIES MOUNTING CLAMPS 130 SERIES CROSS BARS
132-11-G9 - High-Performance Heat Sink for Precision Compression Type Devices. Dimensions (W x L x H) in inches:5.0 x 11.0 x 2.25
132-5-B9 - High performance Heatsink for Compression-type Devices
133-7.5-B-9 - High performance Heatsink for Compression-type Devices
139-1 - Fasteners, Clamp; Clamp Type:Spring; Clamping Force Max:3000lbf; Material:Stainless Steel
139-2 - Fasteners, Clamp; Clamp Type:Spring; Clamping Force Max:5000lbf; Material:Stainless Steel
139-5E - Fasteners, Clamp
139-5G - Fasteners, Clamp
139-5H - Fasteners, Clamp
139-5J - Fasteners, Clamp
139-5K - fastners
145-2 - SPRING LEAF ASSY C5027 REV C
145-C - CROSS BAR ASSY C4899 REV G
151-Q - Epoxy Coating Adhesive. DeltaCoate(TM) 151 is a thermally conuctive dielectric epoxy coating which may be applied using conventional paint and spray equipment. Available only in quarts.
152-1A - DeltaBond(TM) 152 Adhesive. Resin Container Size:Bi-Pack (1oz); Hardener Part Number:Included in P/N 152-1A ("A-4") Type
152-1B - DeltaBond(TM) 152 Adhesive. Resin Container Size:Bi-Pack (1oz); Hardener Part Number:Included in P/N 152-1B ("B-4") Type
152-KA - DeltaBond(TM) 152 Adhesive. Resin Container Size:Kit (7 oz Resin, 0.5 oz Hardener); Hardener Part Number:Included in P/N 152-KA
152-Q - DeltaBond(TM) 152 Adhesive. Resin Container Size:1 quart; Hardener Part Number:A-4 (0.316 lb.), B-4 (0.14lb), C-4 (0.18) (order 1 only)
153-Q - DeltaCast(TM) 153 Adhesive. Resin Container Size:1 gallon; Hardener Part Number:A-4, B-4, C-4 (order 1 only)
154-Q - DeltaBond(TM) 154 Adhesive. Resin Container Size:1 quart; Hardener Part Number:A-4, B-4, C-4 (order 1 only)
156-K - DeltaBond(TM) 156 Adhesive. Resin Container Size:Resin Kit Hardener Syringe- 0.85 fl oz.- 25 ml-2 oz net/0.44 oz fl contents bottle- 12 ml; Hardener Part Number:Included in kit hardener with brush applicator-4.2 oz total weight/kit
173-7-220-P - INSULATOR,SEMI TO-220 .007"THK NONADHESIV (1737220P)
173-7-220P - Gray Thermally Conductive Insulator, No Adhesive-.007 inches Thick. Mechanical Dimensions in inches:0.710 x 0.500 x 0.160 x 0.141; Case Style:TO-220; Material Thickness in inches:0.007
173-7-230P - Gray Thermally Conductive Insulator, No Adhesive-.007 inches Thick. Mechanical Dimensions in inches:0.750 x 0.500 x 0.187 x 0.125; Case Style:TO-220; Material Thickness in inches:0.007
173-7-240A - THERMAL PAD .007" W/ADH TO-220
173-7-240P - Semiconductor hardware, Insulators;
173-7-330P - DeltaPads Thermally Conductive Insulator, TO-3 Style, No adhesive
173-9-210P - Gray Thermally Conductive Insulator, No Adhesive-.009 inches Thick. Mechanical Dimensions in inches:0.687 x 0.562 x 0.218 x 0.125; Case Style:TO-220; Material Thickness in inches:0.009
173-9-220P - Gray Thermally Conductive Insulator, No Adhesive-.009 inches Thick. Mechanical Dimensions in inches:0.710 x 0.500 x 0.160 x 0.141; Case Style:TO-220; Material Thickness in inches:0.009
173-9-230P - Gray Thermally Conductive Insulator, No Adhesive-.009 inches Thick. Mechanical Dimensions in inches:0.750 x 0.500 x 0.187 x 0.125; Case Style:TO-220; Material Thickness in inches:0.009
173-9-240P - Gray Thermally Conductive Insulator, No Adhesive-.009 inches Thick. Mechanical Dimensions in inches:0.750 x 0.500 x 0.187 x 0.147; Case Style:TO-220; Material Thickness in inches:0.009
173-9-280P - DeltaPads Thermally Conductive Insulator, TO-220 Style, No adhesive
173-9-290P - Gray Thermally Conductive Insulator, No Adhesive-.009 inches Thick. Mechanical Dimensions in inches:0.855 x 0.630 x 0.230 x 0.093; Case Style:TO-220; Material Thickness in inches:0.009
174-9-310P - Semiconductor hardware, Insulators;
175-6-210P - Gray Greaseless Thermally Conductive Kapton Reinforced Insulator. Mechanical Dimensions in inches:0.687 x 0.562 x 0.218 x 0.125; Case Style:TO-220
175-6-220P - Gray Greaseless Thermally Conductive Kapton Reinforced Insulator. Mechanical Dimensions in inches:0.710 x 0.500 x 0.160 x 0.141; Case Style:TO-220
175-6-230P - Gray Greaseless Thermally Conductive Kapton Reinforced Insulator. Mechanical Dimensions in inches:0.750 x 0.500 x 0.187 x 0.125; Case Style:TO-220
175-6-240P - Gray Greaseless Thermally Conductive Kapton Reinforced Insulator. Mechanical Dimensions in inches:0.750 x 0.500 x 0.187 x 0.147; Case Style:TO-220
175-6-250P - Semiconductor hardware, Insulators;
175-6-260P - Reinforced Insulator, Kapton , 175 Series, Fits TO-220 Semiconductors
175-6-280P - Gray Greaseless Thermally Conductive Kapton Reinforced Insulator. Mechanical Dimensions in inches:0.860 x 0.740 x 0.200 x 0.160; Case Style:TO-220
175-6-310P - Semiconductor hardware, Insulators;
175-6-320P - Semiconductor hardware, Insulators; Body Material:Kapton; Package/Case:TO-3; Thermal Resistance:0.4
175-6-330P - Gray Greaseless Thermally Conductive Kapton Reinforced Insulator. Mechanical Dimensions in inches:1.650 x 1.140 x 0.140 x 0.093; Case Style:TO-3
175-6-410P - Gray Greaseless Thermally Conductive Kapton Reinforced Insulator. Mechanical Dimensions in inches:0.625 x 0.200; Case Style:DO-4, DO-5
175-6-510P - Semiconductor hardware, Insulators;
175-6-520P - Semiconductor hardware, Insulators;
175-6-610P - Semiconductor hardware, Insulators;
175-6-66P - Reinforced Insulator, Kapton , 175 Series, Sheet Style
17700007WT414 - HEATSINK
180-11-24C - Tape
2016 - 72" EXTRUSION.
205SB - 205 Series Board Level Heat Sink
206-1PABH - HEATSINK VERT ALUM BLK TO-220
207AB - High-Efficiency Heat Sink for Small Metal Can Power Semiconductors-Aluminum, Black Anodized. Type:Dual-Level Star; Heat Sink IDxODxH in inches:0.255 x 0.72 x 0.375; Applicable Case Types:TO-5, VTO-9, TO-11, TO-12, TO-26, TO-29, TO-33, TO-43, TO-45.
207SB - High-Efficiency Heat Sink for Small Metal Can Power Semiconductors-Silver-Bearing Copper; Black Ebonol "C". Type:Dual-Level Star; Heat Sink IDxODxH in inches:0.255x0.72x0.375; Applicable Case Types:TO-5,VTO-9,TO-11,TO-12,TO-26,TO-29,TO-33,TO-43,TO-45.
217-36CT6 - HEATSINK DPAK SMT TIN PLATED
217-36CTE6 - HEATSINK DPAK SMT TIN PLATED
218-40CT3 - HEATSINK ALUM BLACK SMD
218-40CT5 - HEATSINK ALUM NATURAL SMD
230-75AB - HEATSINK TO-220 VERT/HORZ BLK
233-60AB - HEATSINK TO-220 VERT/HORZ BLK
233-60AB-10 - 233 Series Board Level Heat Sink
235-85AB - HEATSINK TO-220 CLIP-ON BLK
236-150AB-05 - Heat Sink
240-118ABH-22 - HEATSINK TO-220 VERT TWIST FIN
243-3PAB - HEATSINK TO-220 CLIP-ON BLK
258 - Board Level Power Semiconductor Heat Sink; Thermal Links for Fused Glass Diodesl Dimensions (L x W x H) in inches:0.500 x 0.250 x 0.340
260-4T5E - Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.370 x 0.380 diameter x 0.290; Weight in pounds:0.0024
260-4TH5E - Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.400 x 0.370 hex x 0.290; Weight in pounds:0.0031
260-6SH5E - Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.557 x 0.370 hex x 0.290; Weight in pounds:0.0037
262-75AB-01 - HEATSINK VERT/HORIZ BLACK TO-220
262-75AB-05 - HEATSINK VERT/HORIZ BLACK TO-220
265-118ABH-22 - HEATSINK VERT ALUM BLACK TO-220
270-AB - Small Footprint Low-Cost Heat Sink-TO-220, TO-202 Case Styles; Height Above PC Board in inches:0.375. Horizontal Mounting Max. Footprint in inches:1.750 x 0.700; Natural Convection/Forced Convection:70 degree C at 4W/6.0 degrees; Weight in pounds:0.0052
271-AB - Top-Mount Booster Heat Sink-TO-220 Case Style; Height Above Semiconductor Case in inches:0.5. Horizontal Mounting Max. Footprint in inches:1.75 x 0.700; Natural Convection:62 degree C at 4W; Forced Convection:5.1 degree C/W at 400 LFM.
272-AB - Small Footprint Low-Cost Heat Sink-TO-220, TO-202 Case Styles; Height Above PC Board in inches:0.375. Horizontal Mounting Max. Footprint in inches:1.750 x 1.450; Natural Convection/Forced Convection:42 degree C at 4W/3.6 degrees; Weight in pounds:0.0105
273-AB - Low-Cost, Low Height Heat Sink-TO-218, TO-220 Case Styles. Height Above PC Board in inches:0.375; Horizontal Mounting Maximum Footprint in inches:0.750 x 0.750; Natural Convection:49 degree C at 2W; Forced Convection:7.2 degree C/W at 400 LFM.
274-1AB - Low-Cost, Low Height Heat Sink-TO-202, TO-220 Case Styles. Height Above PC Board in inches:0.375; Horizontal Mounting Maximum Footprint in inches:0.520 x 0.750; Natural Convection:56 degree C at 2W; Forced Convection:8.0 degree C/W at 400 LFM.
274-2AB - Low-Cost, Low Height Heat Sink-TO-202, TO-220 Case Styles. Height Above PC Board in inches:0.5; Horizontal Mounting Maximum Footprint in inches:0.520 x 0.750; Natural Convection:50 degree C at 2W; Forced Convection:7.0 degree C/W at 400 LFM.
274-3AB - Low-Cost, Low Height Heat Sink-TO-202, TO-220 Case Styles. Height Above PC Board in inches:0.25; Horizontal Mounting Maximum Footprint in inches:0.520 x 0.750; Natural Convection:62 degree C at 2W; Forced Convection:9.0 degree C/W at 400 LFM.
285SC - SpeedClips(TM) for 667 Series Heat Sink for use with 667 Series employ a locking safety tab for mounting. Nominal installed loading force 10 lbs. Material: stainless steel.
286-AB - Aluminum and Copper Low-Cost Wave Solderable Heat Sink-TO-220 Case Style. Height Above PC Board:1.19 inches; Maximum Footprint:1.000 x 0.500 inches; Natural Convection:58 degrees C at 4W; Forced Convection:7.4 degrees C/W at 200 LFM.
286-CBT - Aluminum and Copper Low-Cost Wave Solderable Heat Sink-TO-220 Case Style. Height Above PC Board in inches:1.19; Maximum Footprint in inches:1.000 x 0.500; Natural Convection:58 degree C at 4W; Forced Convection:7.4 degree C/W at 200 LFM.
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